Multipurpose, full wave 3D electromagnetic (EM) simulation software for designing and simulating high-frequency electronic products such as antennas, components, interconnects, connectors, ICs and PCBs.
Ansys HFSS is a 3D electromagnetic (EM) simulation software for designing and simulating high-frequency electronic products such as antennas, antenna arrays, RF or microwave components, high-speed interconnects, filters, connectors, IC packages and printed circuit boards. Engineers worldwide use Ansys HFSS software to design high-frequency, high-speed electronics found in communications systems, advanced driver assistance systems (ADAS), satellites, and internet-of-things (IoT) products.
HFSS’s unmatched capacity, coupled with indisputable accuracy, enables engineers to address RF, microwave, IC, PCB and EMI problems for most complex systems.
*only available with Electronics Enterprise
How Ansys HFSS Mesh Fusion solves much larger designs than ever thought possible
HFSS Mesh Fusion’s patented technology enables much more complex designs to be simulated with the same rigor, accuracy and reliability of Ansys HFSS. It accomplishes this by applying targeted meshing technologies within the same design, appropriate to the local geometry.
HFSS Mesh Fusion continues to use the same “electromagnetically aware” adaptive meshing technology as before without compromising accuracy because a fully coupled electromagnetic matrix is solved with each adaptive mesh step and for each point in a frequency sweep.
The Ansys 2022 R2 update brings major enhancements and new functionality to HFSS, including a Flex PCB workflow, support for encrypted components in IC design and further improvements to simulation turnaround time.
The new HFSS 3D Layout Flex PCB workflow ensures resounding success of any product or system using flex PCBs connecting systems and components.
Engineers working with foundry technology files for defining IC stackups can work with encrypted components in HFSS 3D Layout.
Boosting HFSS performance by reducing design and simulation turnaround time benefits HFSS users, especially engineers who solve designs at a large scale in size and/or complexity.
Ansys HFSS is a 3D electromagnetic simulation software solution for designing and simulating high-frequency electronic products such as antennas, RF and microwave components, high-speed interconnects, filters, connectors, IC components and packages and printed circuit boards.
To install Ansys HFSS, you must be an Ansys customer and have access to the Customer Portal. Ansys HFSS is included in the Electronics software bundle and is also included in the free Ansys Student bundle.
Yes, STL is an import option in HFSS. For finite element model (FEM) analysis, STL files are converted to the HFSS modeler format. For IE and SBR+ analysis, there is an option to import and directly solve to the STL facets.
To download Ansys HFSS, you must be an Ansys customer and have access to the Customer Portal. Ansys HFSS is included in the Electronics software bundle and is also included in the free Ansys Student bundle.
You can learn about Ansys HFSS in several different ways depending on whether you are an existing customer or a student or non-customer.
Intro to Ansys HFSS is a free course available on our Ansys Innovation Courses site where you will learn the basics of Ansys HFSS geometry design and the EM simulation workflow.
These HFSS courses are available to Ansys Customers.
Get step-by-step instructions on designing antennas in Ansys HFSS in this video, which demonstrates how to create the geometry of the dipole antenna and discusses features in HFSS for antenna analysis. "How to Design Antennas in Ansys HFSS."
The Ansys HFSS simulation suite consists of a comprehensive set of solvers to address diverse electromagnetic problems ranging in detail and scale from passive IC components to extremely large-scale EM analyses such as automotive radar scenes for ADAS systems. Its reliable automatic adaptive mesh refinement lets you focus on the design instead of spending time determining and creating the best mesh.
This automation and guaranteed accuracy differentiates HFSS from all other EM simulators, which require manual user control and multiple solutions to ensure that the generated mesh is suitable and accurate.
HFSS is the premier EM tool for R&D and virtual design prototyping. It reduces design cycle time and boosts your product’s reliability and performance.
Users can take advantage of the seamless workflow in Electronics Desktop , which includes advanced electromagnetic field solvers, and dynamically link them to power circuit simulators to predict EMI/EMC performance of electrical devices. These integrated workflows avoid repetitive design iterations and costly recurrent EMC certification tests. Multiple EM solvers intended to address diverse electromagnetic problems, as well as the circuit simulators in Electronics Desktop, help engineers assess the overall performance of their electrical devices and create interference-free designs. These diverse problems range from radiated and conducted emissions, susceptibility, crosstalk, RF desense, RF coexistence, cosite, electrostatic discharge, electric fast transients (EFT), burst, lightning strike effects, high intensity fields (HIRF), radiation hazards (RADHAZ), electromagnetic environmental effects (EEE), electromagnetic pulse (EMP) to shielding effectiveness and other EMC applications.
EMIT’s powerful analysis engine computes all important RF interactions including non-linear system component effects. Diagnosing RFI in complex environments is notoriously difficult and expensive to perform in a testing environment, but with EMIT’s dynamic linked results views, the identification of the root-cause of any interference is rapidly accomplished via graphical signal trace-back and diagnostic summaries that show the exact origin and path that interfering signals take to each receiver. Once the cause of interference is uncovered, EMIT enables rapid evaluation of various RFI mitigation measures in order to arrive at the optimum solution. The new HFSS/EMIT Datalink allows the model for RFI analysis to be created in EMIT directly from the physical 3D model of the installed antennas in HFSS. This provides a seamless end-to-end workflow for a complete RFI solution for RF environments ranging from large platform cosite interference to receiver desense in electronic devices.
A candidate array design can examine input impedances of all elements under any beam scan condition. Phased array antennas can be optimized for performance at the element, subarray or complete array level based on element match (passive or driven) far-field and near-field pattern behavior over any scan condition of interest. Infinite array modeling involves one or more antenna elements placed within a unit cell. The cell contains periodic boundary conditions on the surrounding walls to mirror fields, creating an infinite number of elements. Element scan impedance and embedded element radiation patterns can be computed, including all mutual coupling effects. The method is especially useful for predicting array-blind scan angles that can occur under certain array beam steering conditions. Finite array simulation technology leverages domain decomposition with the unit cell to obtain a fast solution for large finite-sized arrays. This technology makes it possible to perform complete array analysis to predict all mutual coupling, scan impedance, element patterns, array patterns and array edge effects.
It includes EMIT, a unique multi-fidelity approach for predicting RF system performance in complex RF environments with multiple sources of interference. EMIT also provides the diagnostic tools needed to quickly identify root-cause RFI issues and mitigate problems early in the design cycle.
HFSS with SI Circuits can handle the complexity of modern interconnect design from die-to-die across ICs, packages, connectors and PCBs . By leveraging the HFSS advanced electromagnetic field simulation capability dynamically linked to powerful circuit and system simulation, engineers can understand the performance of high-speed electronic products long before building a prototype in hardware.
The ability to simulate encrypted HFSS 3D components means that you no longer need to compromise on accuracy. Designers are no longer forced to use circuit-level components (e.g., S-parameter models) vs. true 3D models into their design, impacting the overall simulation accuracy.
It enables prospective customers of vendors to use encrypted 3D Components in a full system design. The end user receives more confidence in the validity of results by rigorously considering coupling effects of the integration while also protecting the vendor’s design IP. In addition, it also provides full, uncompromised simulation fidelity for encrypted 3D components with HFSS and adaptive meshing delivering its gold-standard accuracy.
HFSS multipaction solver is based on a finite-element particle-in-cell (PIC) method. HFSS provides the multipaction analysis as a postprocessing of the frequency-domain field solutions. With few steps to set up the excitations and boundary conditions for charged particle simulation, you can check whether your design meets the standard for multipaction breakdown prevention.
HFSS RESOURCES & EVENTS
Learn about new features & capabilities, including flex PCB modeling and simulation support, IC design flows with encrypted IP, and further reductions in simulation turnaround time without accuracy loss.
This webinar series shows you how the HFSS adaptive meshing technology handles massive PCB layout geometries and gives you the most accurate results using real customer examples.
This webinar will chart the progress of HFSS with respect to antenna design and how it has evolved into the established leader in the field.
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