Ansys SIwave
Signal Integrity, Power Integrity, and EMI Analysis for PCB Design
A specialized tool for power integrity, signal integrity and EMI analysis of IC packages and PCBs. Solves power delivery systems and high-speed channels in electronic devices.
Dedicated PCB & Package Electromagnetics Simulation Software
SIwave helps you model, simulate and validate high-speed channels and complete power delivery systems typical in modern high-performance electronics. It accurately extracts multi-gigabit SERDES and memory buses, providing product sign-off compliance for various designs. SIwave’s full wave extraction of complete power distribution networks (PDN) enables you to verify noise margins and ensure impedance profiles are met through automatic decoupling analysis in low-voltage designs.
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Full-Wave SI/PI Extraction
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Feature: Virtual
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Impedance / Crosstalk / EMI Scanning
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Electro-Thermal Design
Product Specs
SIwave helps you model, simulate and validate high-speed channels and complete power delivery systems typical in modern high-performance electronics. It accurately extracts multi-gigabit SERDES and memory buses, providing product sign-off compliance for various designs.
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Layout and Geometry Import -
IBIS and IBIS-AMI SerDes Analysis -
Impedance and Crosstalk Scanning -
EMI Solution
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Electrothermal Analysis -
Virtual Compliance -
Multidomain System Modeling
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High-Performance Computing -
Automated Decoupling Capacitor -
Electromigration Analysis
JULY 2022
What's New
The Ansys 2022 R2 update brings a set of enhancements and capabilities to Ansys SIwave. Compute results in the transition region between DC to AC, support for single IBIS AMI models, and automatic generation of HFSS Regions when leveraging SIwave solver in HFSS 3D Layout.
AC/DC Blending
The new and unique AC/DC blending algorithm enables unbeatable accuracy, which benefits the SIwave SYZ calculations in HFSS 3D Layout.
IBIS AMI Model Support
DDR Wizard in SIwave now supports single IBIS AMI models.
Auto Generation of HFSS 3D Layout Regions
SIwave can automatically generate HFSS Regions when a user leverages the SIwave solver in HFSS 3D Layout. The regions are automatically created in areas of 3D activities (such as port locations and vias) and modified by the user.
Case Studies
SIWAVE CAPABILITIES
SIwave leverages advanced electromagnetic, thermal and mechanical simulators to dynamically link circuit and system simulation
Successful design of next-generation electronic products requires power integrity, signal integrity and thermal integrity co-analysis. SIwave uniquely handles the complexity of interconnect design from die-to-die across ICs, packages, connectors and boards.
SIwave enables electronics companies to achieve a competitive advantage with faster time to market, reduced costs and improved system performance.
Key Features
SIwave helps you understand the performance of high-speed electronic products long before building a prototype in hardware.
- 3-D solid modeling
- Power-integrity analysis
- Signal-integrity analysis
- Many extraction types
- Advance adaptive mesh refinement
- High-performance computing
There are various extraction types supported by SIwave such as IC packaging RLCG IBIS for signals and power, touch panel RLCG unit cell, bus bar RLCG, power inverter/converter, and a specialized thin-plane solver for touch panel extractions.
EMI Scanner and EMI Xplorer provide automatic and customizable EMI design rule checks to quickly identify areas of potential interference on the design prior to simulation.
Ansys SIwave provides a DDR virtual compliance kit which in combination with DDR Wizard provides an end-to-end virtual compliance for designs using DDR technology. Additionally, our new SPISim technology allows for simple compliance reporting for USB-C and COM calculations for IEEE 802.3bj and 802.3bs channels. The programming environment also enables customization and support to add eye masks and limit lines for different type of standards.
This multiphysics solution enables accurate thermal modeling of IC packages and PCBs using DC power loss from SIwave as a heat source. Icepak solves the challenges associated with dissipation of thermal energy from electronic components that may cause premature component failure due to overheating. You can then evaluate thermal stress with Ansys Mechanical . This multiphysics approach enables you to perform coupled EM–thermal–stress analysis for a complete understanding of the design prior to manufacturing.
SIWARE CABLE RESOURCES & EVENTS
Featured Webinars
On Demand Webinar
Real-time Optical Simulation for Reliable and Innovative Automotive Lighting Designs
Learn how Speos predicts the illumination and optical performance of systems, for both interior and exterior lighting, to help engineers reduce development time and costs while improving their product’s accuracy.
On Demand Webinar
Automotive Exterior Lighting Industry Best Practices
This webinar will cover automotive exterior lighting industry best practices, where an overview of the key benefits of Ansys Speos and Ansys VRXPERIENCE simulations and the capabilities required to realize these benefits will be shared.
On Demand Webinar
Optimizing Speed with HFSS Regions in SIwave
Learn how the speed and accuracy of Ansys SIwave can be improved by leveraging HFSS Regions in SIwave, a cutting-edge technique for supporting high-speed printed circuit board (PCB) channel design requirements.
On Demand Webinar
Ansys 2021 R1 Update: EMA3D Cable Faster EMC Solving for Large Systems
Join us for this webinar which showcases new Ansys EMA3D Cable features to help you streamline manual cable design.
Case Studies
Blogs
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Overcome Automotive Electronics Reliability Engineering Challenges -
Ansys 2020 R1 Helps Users Collaborate on Multiphysics Simulations -
Understanding 5G Infrastructure Benefits & Challenges -
Ansys HFSS and Ansys SIwave Extend Their HPC Capabilities on Ansys Cloud -
How to Reduce RFI in the Antenna Design of IoT and Consumer Electronics -
Making Wireless Multigigabit Data Transfer Reliable with Simulation
Ansys software is accessible
It's vital to Ansys that all users, including those with disabilities, can access our products. As such, we endeavor to follow accessibility requirements based on the US Access Board (Section 508), Web Content Accessibility Guidelines (WCAG), and the current format of the Voluntary Product Accessibility Template (VPAT).
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See What Ansys Can Do For You
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