Solve your biggest thermal, electrical and mechanical reliability challenges.
Best practices for ensuring and predicting electronics reliability require comprehensive multi-physics simulations. Ansys ensures reliability success by developing solutions and workflows that overcome today’s biggest simulation and design challenges.
Ansys Electronics Reliability solutions allow organizations to capture a wide-range of parts, materials, simulation and other data, as well as access to critical, simulation-ready material and component data.
Reliability predictions based on physics of failure (PoF) principles resides at the core of the Ansys Electronics Reliability portfolio. Using Ansys simulation tools, electronics manufacturers can determine how long it takes for a product to fail and why the failure occurred.
Ansys Electronics Reliability tools allow engineers to create comprehensive simulation workflows that include high-levels of automation.
Integrated workflows between Ansys Sherlock, Icepak, Mechanical, LS-DYNA, and more provide the simulation results necessary to optimize product designs and ensure reliability in the field.
A computational fluid dynamics (CFD) solver for electronics thermal management. It predicts airflow, temperature and heat transfer in IC packages, PCBs, electronic assemblies, enclosures and power electronics.
Solve broad structural analysis needs with a suite of finite element analysis (FEA) solutions that provides in-depth analysis of structural and coupled-field behaviors.
Engage with a powerful, explicit simulation tool with integration into Ansys Mechanical. A large array of capabilities and material models enable complex models with great scalability.
A 3D electromagnetic field solver to design high-frequency and high-speed electronic components. Its FEM, IE, asymptotic and hybrid solvers address RF, microwave, IC, PCB and EMI problems.
Ansys implements key safety analysis methods in one integrated tool. It supports the efficient and consistent execution of the analysis activities that are required by safety standards.
Simulation isn’t a one size fits all. That’s why Ansys provides multiple electronics reliability workflows to fit your product and your reliability needs.
Ansys solutions for PCB reliability include a multi-physics workflow that uses a suite of leading simulation tools. Using our workflow solutions, you can simulate electrical, thermal, and mechanical effects to determine product reliability.
In this webinar, learn how Ansys SIwave, Ansys Icepak, Ansys Mechanical and Ansys Sherlock can be used as a comprehensive multi-physics solution to optimize PCB reliability.
This webinar will demonstrate an automated process of thermal modeling of printed circuit boards. It will present a workflow to translate ECAD data to a thermal and mechanical model in Ansys Icepak, followed by the transfer of results into Ansys Sherlock for solder fatigue analysis.
This webinar covers product integrations, relevant updates for each tool that will enable faster and more efficient simulations and updates to key workflows that help users address important electronics reliability challenges.