Ansys Electronics
Electromagnetic, Signal Integrity, Thermal and Electro-Mechanical Simulation Solutions
Electronics Business Value
The use of Ansys Electronics solution suite minimizes the testing costs, ensures regulatory compliance, improves reliability and drastically reduces your product development time. All this while helping you build the best-in-class and cutting-edge products. Leverage the simulation capability from Ansys to solve the most critical aspects of your designs
Ansys Electronics
Electronics Design Simulation
With our solutions, we help you solve the most critical aspects of your product designs through simulation. If you work with antenna, RF, microwave, PCB, package, IC design or even an electromechanical device, we provide you with the industry gold standard simulators. These solutions help you solve any electromagnetic, temperature, SI, PI, parasitic, cabling and vibration challenges in your designs. We build on this with complete product simulation, allowing you to achieve first pass success designing an airplane, car, cellphone, laptop, wireless charger, or any other system.
Ansys Electronics Desktop (AEDT)
The Ansys Electronics Desktop (AEDT) is a platform that enables true electronics system design. AEDT provides access to the Ansys gold-standard electromagnetics simulation solutions such as Ansys HFSS, Ansys Maxwell, Ansys Q3D Extractor, Ansys SIwave, and Ansys Icepak using electrical CAD (ECAD) and mechanical CAD (MCAD) workflows. In addition, it also includes direct links to the complete Ansys portfolio of thermal, fluid, and mechanical solvers for comprehensive Multiphysics analysis. Tight integration among these solutions provides the user with unprecedented ease of use for setup and faster resolution of complex simulations for design and optimization. For more information on the AEDT platform, contact us here .
July 2022
What's New
Ansys Electronics solutions continue to bring best-in-class technologies to address PCB, 3D IC package, EMI/EMC, thermal, cabling, and electromechanical design challenges with significant advancements in 5G, autonomous, and electrification simulation.
Electronics Products
A 3D electromagnetic field solver to design high-frequency and high-speed electronic components. Its FEM, IE, asymptotic and hybrid solvers address RF, microwave, IC, PCB and EMI problems.
- Solves multi-layer packages
- 3D layout workflow for PCBs and packages
- High-frequency electromagnetic solvers
- IP protection through 3D components
A specialized tool for simulating power and signal integrity as well as EMI analysis of IC/PCB packages. Solve for power delivery systems and high-speed channels in electronic devices.
- Electrothermal and mechanical analysis
- IBIS and IBIS-AMI SerDes analysis
- Virtual compliance
- Impedance, crosstalk and EMI scanning
- Automated decoupling capacitor Optimization
A computational fluid dynamics (CFD) solver for electronics thermal management. It predicts airflow, temperature and heat transfer in IC packages, PCBs, electronic assemblies, enclosures and power electronics.
- Unstructured, body-fitted meshing
- Built-in high-fidelity CFD solver
- Comprehensive thermal reliability solution
- Industry leading multiscale multiphysics
- Board-level electrothermal coupling
- Extensive libraries for thermal physics
Ansys EMA3D Cable is a cable EMC modelling tool that specializes in analyzing lightning-induced electromagnetic (EM) effects on large platforms.
- SpaceClaim’s Direct Modeler UI
- Cable Cross-Sections Electrostatic Simulation
- Streamiled Cable-ficused Workflow
- Hybrid Transmission Line Harness
An electromagnetic field simulation solver for electric machines and electromechanical devices. Solve static, frequency-domain and time-varying electric fields.
- 2D and 3D electromagnetic FEA
- Component to system - Reduced-order modeling
- Advanced electromagnetic material
- Automatic adaptive meshing
- Multiphysics analysis
- Slice-only technology
A template-based design tool for multiphysics analyses of electric motors across the full torque-speed operating range to optimize EV performance, efficiency and size.
- Intuitive, template-based setups
- Built-in electromagnetic, thermal and mechanical solvers
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Rapid analysis of efficiency maps, torque/speed characteristics and drive cycles
- Thermal sizing of machines
Automated RF, microwave and digital filter design, synthesis and optimization in an efficient, straightforward process.
- Automatic filter synthesis
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Embedded component databases
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HFSS integration
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Widest range of filter topologies
Ansys Q3D Extractor calculates the parasitic parameter of frequency-dependent resistance, inductance, capacitance and conductance (RLCG) for electronic products.
- Solid modeling
- Power/signal integrity analysis
- Various extraction types
- Automatic, adaptive mesh refinement
Provides fast and accurate life predictions for electronic hardware at the component, board and system levels in early design stages to help future-proof your design.
- Solder fatigue analysis
- Translates ECAD to FEA/CFD in minutes
- Turns stress (thermal, mechanical) into life prediction
- Embedded, populated, modifiable libraries
- Validated time-to-failure predictions
3D modeling solution of charging, discharging and charge carrier transport across a wide range of applications, in one streamlined workflow.
- SpaceClaim’s Direct Modeler UI
- 3D Particle Transport
- Surface and Internal Charging
- ESDs in Air and Dielectrics
Capabilities
Reduce your design-cycle and time-to-market by ensuring your electronics design is validated, cost-effective, operable and certification-ready.
- Power integrity and signal integrity analysis
- Electromagnetic interference and compatibility
- Wireless and RF
- Thermal management
- Electric machine analysis
- Electronics reliability simulation
These integrated electromagnetics (EM) and circuit simulation tools essential for designing high-speed serial channels, parallel buses and complete power delivery systems found in modern high-speed electronic devices.
Multiple EM solvers intended to address diverse electromagnetic problems ranging from radiated and conducted emissions, susceptibility, crosstalk, RF desense, RF coexistence, cosite, electrostatic discharge, electric fast transients (EFT), burst, lightning strike effects, high intensity fields (HIRF), radiation hazards (RADHAZ), electromagnetic environmental effects (EEE), electromagnetic pulse (EMP) to shielding effectiveness and other EMC applications. Diagnose, isolate and eliminate EMI and radio-frequency issues (RFI) early in the design cycle.
By leveraging advanced electromagnetic-field simulators dynamically linked to powerful harmonic-balance and transient circuit simulation, engineering teams consistently achieve best-in-class design in a broad range of applications including antennas, phased arrays, passive RF/mW components, integrated multi-chip modules, advanced packaging, and RF PCBs.
Perform electronics cooling simulation and thermal analysis for chip-package, PCB and systems, as well as conduct thermomechanical stress analysis and airflow analysis to select the ideal heat sink or fan solution
Ansys software simulates the interactions between these components, and the design flow incorporates thermal and mechanical analysis for evaluating cooling strategies and analyzing critical mechanical effects like noise-vibration-harshness (NVH).
Manage material information, optimize CAD geometries, perform complex multiphysics analysis, predict time-to-failure, and implement automation across the lifetime of your design.
"After a 2 year extensive evaluation and measurement correlation of the ANSYS products against multiple industry products, the measurement comparisons from DC to 50 GHz of multiple package and PCB custom test structures have shown that the ANSYS solutions are robust and accurate across the widest range of applications and structures."
—Scott McMorrow, President, Teraspeed Consulting Group
Applications
Featured Webinars
On Demand Webinar
Ansys 2021 R2: Introducing New Ansys Solutions for RF/Microwave Filter Design
Learn about two new RF/microwave filter design and analysis solutions that will help engineers increase the efficiency of filter design.
On Demand Webinar
Ansys 2021 R2: What’s New in Ansys Icepak
2021 R2 introduces significant improvements to electronics thermal management analyses. From native Joule heating to significant improvements in MCAD geometry handling, mesh and solution processing lead to productivity gains for Icepak.
Webinar on Demand
Ansys 2021 R2: EMA3D Cable Update: Faster EMC Solving for Electronic Devices
Learn how the new features in Ansys EMA3D Cable can help you tackle electromagnetic interference (EMI) challenges including radiated emissions, radiated immunity, electrostatic discharge (ESD) and interference between systems integrated on a platform.
CASE STUDIES
See What Ansys Can Do For You
See What Ansys Can Do For You
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