Intelligent connectivity is transforming our world beyond recognition from autonomous vehicles to the Industrial Internet of Things. Simulation is critical to making these technologies a reality.
For 5G, autonomous vehicles, smart products, homes, cities, and factories to become reality, the enabling electronics technologies must deliver unprecedented levels of reliability. With innumerable sensors, microprocessors, and communication components, engineers face immense product reliability and performance challenges. Engineering simulation plays a critical role in helping high-tech companies deliver innovative and reliable products that achieve and exceed their target performance, energy-efficiency, cost, and speed-to-market goals.
Win the Race to 5G and Beyond
With quality of service a key metric, engineers face critical challenges ranging from mmWave design to beamforming, MIMO and signal and power integrity. Ansys’ comprehensive multiphysics solutions are the only way to win the race.
Lead in Digital Transformation, AI/ML and IIoT
Today’s intelligent products utilize artificial intelligence (AI), sensors and communications technologies to deliver comfort, convenience and efficiency. Simulation enables engineers to challenge conventional design wisdom and make the impossible possible.
Drive Intelligence and Automation Through IIoT
Multiphysics simulation solutions are critical to accelerate the development of reliable, high-performance, energy-efficient components and systems in the IIoT era.
Engineering Productivity and Innovation
Companies in the high-tech industry must innovate at speed to survive. Simulation led digital transformation enables companies to innovate faster, at lower cost and with fewer resources.
High tech electronics systems are the backbone for disruptive transformations occurring in industries ranging from mobility to energy, to the fourth industrial revolution and in silico healthcare. Ansys delivers high-tech electronics simulation applications spanning from the scale of silicon in semiconductor design and fabrication, to thermal and electronic reliability in packages and systems to electrically large environments such as cities.
This e-book introduces the five critical capabilities required to deliver the new design paradigm supported by real world examples.
Many industries, ranging from consumer electronics to automotive and the military, are starting to design System-on-Chip (SoC) integrated circuits that are optimized for their own needs. At the same time, equipment designers are integrating multiple chips into a single package to create more complete and capable solutions. The battle for market share will be won and lost where these worlds come together: 3D Integrated Circuits (3D-IC).
As connectivity, digitalization and autonomy proliferate, the boundaries between industries are blurring at an unprecedented pace. Promising to unleash $3TN in global technology market spending, the new competitive battleground is to be found where the system electronics and semiconductor worlds collide: The 3D Integrated Circuit System on Chip.