Thermal Analysis Software
Know how thermal energy will affect the efficiency, reliability and safety of your products.
ANSYS APPLICATIONS
3D Thermal Analysis and Modeling
When a smartphone is held in a human hand. When a high-power circuit board is confined in a compact enclosure. When industrial equipment is exposed to extreme weather. Ansys thermal analysis solutions help engineers solve the most complex thermal challenges to predict how their designs will perform with temperature changes.
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Account for temperature fluctuations
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Prevent overheating issues
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Improve product reliability across environments
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Avoid multiple product prototypes and test failures
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Minimize last minute design iterations
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Improve collaboration between electrical and mechanical engineering teams
Find the right thermal simulation software for your use case
Thermal simulation provides deeper insights into a product’s behavior with different temperature scenarios, so engineers can see how their designs will be impacted by temperature changes. Knowing these outcomes enables teams to quickly adjust designs to achieve peak product performance.
Ansys simulations provide for a wide range of thermal management issues. Across industries and applications, many of these powerful solvers can be integrated through Ansys Workbench for accurate answers to virtually any thermal problem.
Primary Thermal Applications
Electronics thermal simulation
Understand the thermal behavior of your electronic designs by simulating cooling strategies and overall thermal management for electronic assemblies within all types of products. See how each component’s response to heat and cold will affect overall performance.
PCB thermal simulation
Identify thermal problems in printed circuit boards and integrated circuits to prevent degradation in performance of electronics devices across all industries: automotive, aerospace and defense, consumer electronics, healthcare and energy.
Battery thermal simulation
Ensure a reliable and long-lasting battery by keeping it within its desired operating temperature range. Improve battery power and longevity while also identifying ways to reduce the size of batteries for engines and electronic devices.
Structural analysis
Identify how temperature distribution can cause materials in your design to expand and contract. Test multiple scenarios to measure stresses and deformations caused by changes in temperature.
Featured Products
A computational fluid dynamics (CFD) solver for electronics thermal management. It predicts airflow, temperature and heat transfer in IC packages, PCBs, electronic assemblies, enclosures and power electronics.
- Unstructured, body-fitted meshing
- Built-in high-fidelity CFD solver
- Comprehensive thermal reliability solution
- Industry leading multiscale multiphysics
- Board-level electrothermal coupling
- Extensive libraries for thermal physics
CFD software known for its advanced physics modeling and renowned for industry leading accuracy.
- Modern user-friendly interface
- Single window workflow—pre to post-processing
- Streamlined meshing and physics workflows
- Advanced physics modeling
- Efficient meshing and solver HPC scaling
Solve broad structural analysis needs with a suite of finite element analysis (FEA) solutions that provides in-depth analysis of structural and coupled-field behaviors.
- Easy to Use, Multi-Purpose Tool
- Persistent, Dependable Solver Technology
- Dynamic, Integrated Platform
Provides fast and accurate life predictions for electronic hardware at the component, board and system levels in early design stages to help future-proof your design.
- Solder fatigue analysis
- Translates ECAD to FEA/CFD in minutes
- Turns stress (thermal, mechanical) into life prediction
- Embedded, populated, modifiable libraries
- Validated time-to-failure predictions
An electromagnetic field simulation solver for electric machines and electromechanical devices. Solve static, frequency-domain and time-varying electric fields.
- 2D and 3D electromagnetic FEA
- Component to system - Reduced-order modeling
- Advanced electromagnetic material
- Automatic adaptive meshing
- Multiphysics analysis
- Slice-only technology
A specialized tool for simulating power and signal integrity as well as EMI analysis of IC/PCB packages. Solve for power delivery systems and high-speed channels in electronic devices.
- Electrothermal and mechanical analysis
- IBIS and IBIS-AMI SerDes analysis
- Virtual compliance
- Impedance, crosstalk and EMI scanning
- Automated decoupling capacitor Optimization
- RedHawk-SC option for 3D/2.5D chip-package co-analysis
- Power integrity analysis of coupled chip-package system
- Thermal simulation
- Identifies thermal-mechanical stress
- Comprehensive early prototyping features
- Integrated with board/system analysis tools
Get help with your thermal challenges
Experts from the Ansys Customer Excellence (ACE) team are dedicated to helping you get the most from our thermal simulation software. The ACE team includes over 450 Ph.D.s who have solved a vast array of engineering simulation problems so they are well-equipped to help you overcome whatever challenges you are facing.
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